标题:Effect of Crystallographic Anisotropy on Micro EDM Process
作者:Liu, Qingyu; Zhang, Qinhe; Zhang, Min; Zhang, Jianhua
作者机构:[Liu, Qingyu; Zhang, Qinhe; Zhang, Min; Zhang, Jianhua] Shandong Univ, Key Lab High Efficiency & Clean Mech Manufacture, Minist Educ, Sch Mech Engn, J 更多
通讯作者:Zhang, Qinhe
通讯作者地址:[Zhang, QH]Shandong Univ, Key Lab High Efficiency & Clean Mech Manufacture, Minist Educ, Sch Mech Engn, Jinan 250061, Shandong, Peoples R China.
来源:MATERIALS AND MANUFACTURING PROCESSES
出版年:2015
卷:30
期:8
页码:961-967
DOI:10.1080/10426914.2014.962660
关键词:Anisotropy; Monocrystalline; Silicon; Crystal; Discharge; Electrical;; Machining
摘要:In this paper, experiments are conducted by machining from different crystallographic orientations of monocrystalline silicon, and the effects of crystallographic orientation on the micro electrical discharge machining (EDM) process are discussed. The results demonstrate that the machining speed and surface roughness are varied when crystallographic orientation changes. The surface roughness is seen to vary by as much as twofold with crystallographic orientation, while the ratio between the maximum and minimum values of material removal rate is 1.76. The unique material removal mechanism of micro EDM enhances the effects of crystal anisotropy on micro electrical discharge machining process.
收录类别:EI;SCOPUS;SCIE
WOS核心被引频次:7
Scopus被引频次:8
资源类型:期刊论文
原文链接:https://www.scopus.com/inward/record.uri?eid=2-s2.0-84930085926&doi=10.1080%2f10426914.2014.962660&partnerID=40&md5=68468b5e95d8dec146d8f475b3beec1e
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