标题:3D Multi-Processors System on Chip Design Method and Performance Analysis
作者:Zeng Fantai; Ivanov, Andre
通讯作者:Zeng, FT
作者机构:[Zeng Fantai] Shandong Univ, Sch Informat Sci & Engn, Jinan 250100, Shandong, Peoples R China.; [Ivanov, Andre] Univ British Columbia, Dept Elect & 更多
会议名称:2nd IEEE International Conference on Computer Science and Information Technology
会议日期:AUG 08-11, 2009
来源:2009 2ND IEEE INTERNATIONAL CONFERENCE ON COMPUTER SCIENCE AND INFORMATION TECHNOLOGY, VOL 2
出版年:2009
页码:196-+
DOI:10.1109/ICCSIT.2009.5234385
关键词:Interconnection Architecture; Network on chip (NoC); DA-MPB (Directly; Access Multi-port buffer); 3D MP-SoC (Three Dimensional Multiprocessors; System on Chips); 3D IC design
摘要:We propose the three dimensional direct access multi-port buffer (3D DA-MPB) architecture for the design of 3D MP-SoCs using the wafer stack method as a fabrication technology. We design a 3D interconnection architecture template. The design method can integrate numerous processors onto a single chip. We illustrate the data transfer process between multi-port buffer storage blocks through simulations. We use the solution of master interface access to resolve the data transfer path routing problem between wafer layers.; We analyze the characteristics of 3D MP-SoC and evaluate the 3D MP-SoC performance through simulations. We consider interconnect area and interconnect delay improvements, global wire length shorting, and increased throughput.
收录类别:CPCI-S
资源类型:会议论文
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