标题:Dual-Link hierarchical cluster-based interconnect architecture for 3D Network on Chip
作者:Sun, Guang ;Li, Yong ;Zhang, Yuanyuan ;Lin, Shijun ;Su, Li ;Jin, Depeng ;Zeng, Lieguang
作者机构:[Sun, Guang ;Lin, Shijun ] Xiamen University, Xiamen, China;[Zhang, Yuanyuan ] Shandong University, Jinan, China;[Li, Yong ] Huazhong University of Sc 更多
通讯作者:Sun, G
来源:World Academy of Science, Engineering and Technology
出版年:2010
卷:70
页码:657-661
关键词:Area; Interconnect architecture; Network on Chip (NoC); Performance; Three Dimensional Integrate Circuit (3D IC)
摘要:Network on Chip (NoC) has emerged as a promising on chip communication infrastructure. Three Dimensional Integrate Circuit (3D IC) provides small interconnection length between layers and the interconnect scalability in the third dimension, which can further improve the performance of NoC. Therefore, in this paper, a hierarchical cluster-based interconnect architecture is merged with the 3D IC. This interconnect architecture significantly reduces the number of long wires. Since this architecture only has approximately a quarter of routers in 3D mesh-based architecture, the average number of hops is smaller, which leads to lower latency and higher throughput. Moreover, smaller number of routers decreases the area overhead. Meanwhile, some dual links are inserted into the bottlenecks of communication to improve the performance of NoC. Simulation results demonstrate our theoretical analysis and show the advantages of our proposed architecture in latency, throughput and area, when compared with 3D mesh-based architecture.
收录类别:EI;SCOPUS
资源类型:期刊论文
原文链接:https://www.scopus.com/inward/record.uri?eid=2-s2.0-78651554847&partnerID=40&md5=9cb4b542be921c8c2dc85e8c625cb348
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