标题:Three-dimensional surface inspection for semiconductor components with fringe projection profilometry
作者:Deng, Fuqin; Ding, Yi; Peng, Kai; Xi, Jiangtao; Yin, Yongkai; Zhu, Ziqi
作者机构:[Deng, Fuqin] Harbin Inst Technol, Shenzhen Grad Sch, Shenzhen 518055, Peoples R China.; [Ding, Yi; Peng, Kai] Huazhong Univ Sci & Technol, Sch Elec 更多
会议名称:Conference on Optical Metrology and Inspection for Industrial Applications IV held as part of SPIE/COS Photonics Asia Conference
会议日期:OCT 12-14, 2016
来源:OPTICAL METROLOGY AND INSPECTION FOR INDUSTRIAL APPLICATIONS IV
出版年:2016
卷:10023
DOI:10.1117/12.2246094
摘要:With the increasing integration level of components in modern electronic devices, three-dimensional automated optical inspection has been widely used in the manufacturing process of electronic and communication industries to improve the product quality. In this paper, we develop a three-dimensional inspection and metrology system for semiconductor components with fringe projection profilometry, which is composed of industry camera, telecentric lens and projection module. This system is used to measure the height, flatness, volume, shape, coplanarity for quality checking. To detect the discontinuous parts in the internal surface of semiconductor components, we employ the fringes with multiple spatial frequencies to avoid the measurement ambiguity. The complete three-dimensional information of semiconductor component is obtained by fusing the absolute phase maps from different views. The practical inspection results show that the depth resolution of our system reaches 10 mu m. This system can be further embedded for the online inspection of various electronic and communication products.
收录类别:CPCI-S;EI;SCOPUS
WOS核心被引频次:1
Scopus被引频次:3
资源类型:会议论文;期刊论文
原文链接:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85011423402&doi=10.1117%2f12.2246094&partnerID=40&md5=994962b7080e565409fe682e0f8158ab
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