标题:A generalized approach on bending and stress analysis of beams with piezoelectric material bonded
作者:Chen, Ning; Yan, Peng; Ouyang, Jun
作者机构:[Chen, Ning; Yan, Peng] Shandong Univ, Key Lab High Efficiency & Clean Mech Manufacture, Minist Educ, Sch Mech Engn, Jinan 250061, Shandong, Peoples R 更多
通讯作者:Yan, P;Yan, P;Yan, P;Yan, Peng
通讯作者地址:[Yan, P]Shandong Univ, Key Lab High Efficiency & Clean Mech Manufacture, Minist Educ, Sch Mech Engn, Jinan 250061, Shandong, Peoples R China;[Yan, P]S 更多
来源:SENSORS AND ACTUATORS A-PHYSICAL
出版年:2019
卷:290
页码:54-61
DOI:10.1016/j.sna.2019.02.029
关键词:Piezoelectric; Transverse strain effect; Smart composite structure;; Bender; Stress; Nano-manipulation
摘要:The modeling and analysis of piezoelectric cantilevers are critically important in the design of micro intelligent systems, where piezoelectric beams serve as major components in micro sensors, actuators or energy harvesters. In this paper, we propose an analogy modeling method for the unimorph and bimorph piezoelectric beams, which helps to improve the accuracy of the neutral plane location of piezoelectric beams with different thickness ratios and total thicknesses. In particular, the strains of each layer are obtained by employing the analogy modeling method with the consideration of the transverse strain effect, where the force balance and moment balance equations of the final state of piezoelectric beams are derived under electric fields to reveal the relationship between the external deflection and the internal stress distribution of piezoelectric beams. To verify the effectiveness of the proposed approach, the bending characteristics of unimorph and bimorph piezoelectric beams (PZT-5A) are comprehensively tested under various electric fields, where theoretical values agree well with experiments and simulations. Compared with existing results, the proposed method provides a more general and accurate approach to characterize the properties of deflection and internal stress distribution for piezoelectric beams, which can be better used to study the stress of the adhesive layers, the geometric dimension optimization and the dynamics of piezoelectric beams in micro sensor or actuator applications. (C) 2019 Elsevier B.V. All rights reserved.
收录类别:EI;SCIE
资源类型:期刊论文
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