标题：Effects of thermal conductivity on the thermal contact resistance between non-conforming rough surfaces: An experimental and modeling study
作者：Bi D.; Jiang M.; Chen H.; Liu S.; Liu Y.
作者机构：[Bi, D] School of Agricultural Engineering and Food Science, Shandong University of Technology, Zibo, China;[ Jiang, M] School of Agricultural Enginee 更多
通讯作者地址：[Liu, S] School of Agricultural Engineering and Food Science, Shandong University of TechnologyChina;
来源：Applied Thermal Engineering
关键词：Laser photothermal method; Modeling; Non-conforming rough surfaces; Thermal conductivity; Thermal contact resistance
摘要：An experimental investigation of the thermal contact resistance (TCR) between non-conforming rough surfaces was conducted. Experiments demonstrated that the TCR of OFC-OFC (Oxygen-Free Copper) and SS304-SS304 (Stainless Steel 304) decreased as the thermal conductivity increased. Similarly, the TCR of AlN-AlN ceramics decreased when the thermal conductivity increased from 300 to 347 W·m−1·K−1 at temperatures ranging from 90 to 140 K. The variation between the TCR and the thermal conductivity first exhibited an increasing trend and then a decreasing trend. Experiments revealed that the effect of the material with the lower thermal conductivity was dominant, such as OFC-SS304 and OFC-AlN ceramics. The TCR of the dissimilar contact materials was influenced significantly by the material that demonstrated a lower thermal conductivity at 0.35 MPa. The TCR of OFC-OFC and the thermal conductivity exhibited an exponential relationship under low pressure conditions and a polynomial relationship when the external pressure ranged from 0.53 to 0.71 MPa. The relationship between the TCR of OFC-SS304 and the harmonic mean thermal conductivity exhibited an exponential relationship from 0.23 to 0.68 MPa. The results presented in this study provided not only a better understanding of the TCR but also a database for engineering applications. © 2020 Elsevier Ltd