标题:Effects of thermal conductivity on the thermal contact resistance between non-conforming rough surfaces: An experimental and modeling study
作者:Bi, Dongmei; Jiang, Mei; Chen, Huanxin; Liu, Shanjian; Liu, Yaya
作者机构:[Bi, Dongmei; Jiang, Mei; Liu, Shanjian; Liu, Yaya] Shandong Univ Technol, Sch Agr Engn & Food Sci, Zibo, Peoples R China.; [Chen, Huanxin] Huazhong 更多
通讯作者:Liu, Shanjian;Liu, Shanjian
通讯作者地址:Liu, SJ (corresponding author), Shandong Univ Technol, Sch Agr Engn & Food Sci, Zibo, Peoples R China.
来源:APPLIED THERMAL ENGINEERING
出版年:2020
卷:171
DOI:10.1016/j.applthermaleng.2020.115037
关键词:Thermal conductivity; Thermal contact resistance; Non-conforming rough; surfaces; Laser photothermal method; Modeling
摘要:An experimental investigation of the thermal contact resistance (TCR) between non-conforming rough surfaces was conducted. Experiments demonstrated that the TCR of OFC-OFC (Oxygen-Free Copper) and SS304-SS304 (Stainless Steel 304) decreased as the thermal conductivity increased. Similarly, the TCR of AlN-AlN ceramics decreased when the thermal conductivity increased from 300 to 347 W.m(-1).K-1 at temperatures ranging from 90 to 140 K. The variation between the TCR and the thermal conductivity first exhibited an increasing trend and then a decreasing trend. Experiments revealed that the effect of the material with the lower thermal conductivity was dominant, such as OFC-SS304 and OFC-AlN ceramics. The TCR of the dissimilar contact materials was influenced significantly by the material that demonstrated a lower thermal conductivity at 0.35 MPa. The TCR of OFC-OFC and the thermal conductivity exhibited an exponential relationship under low pressure conditions and a polynomial relationship when the external pressure ranged from 0.53 to 0.71 MPa. The relationship between the TCR of OFC-SS304 and the harmonic mean thermal conductivity exhibited an exponential relationship from 0.23 to 0.68 MPa. The results presented in this study provided not only a better understanding of the TCR but also a database for engineering applications.
收录类别:EI;SCOPUS;SCIE
资源类型:期刊论文
原文链接:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85079848124&doi=10.1016%2fj.applthermaleng.2020.115037&partnerID=40&md5=7bbe0e2601bb87440f82f91d19861d07
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