标题:Effects of thermal conductivity on the thermal contact resistance between non-conforming rough surfaces: An experimental and modeling study
作者:Bi D.; Jiang M.; Chen H.; Liu S.; Liu Y.
作者机构:[Bi, D] School of Agricultural Engineering and Food Science, Shandong University of Technology, Zibo, China;[ Jiang, M] School of Agricultural Enginee 更多
通讯作者:Liu, S(liushanjian08@163.com)
通讯作者地址:[Liu, S] School of Agricultural Engineering and Food Science, Shandong University of TechnologyChina;
来源:Applied Thermal Engineering
出版年:2020
卷:171
DOI:10.1016/j.applthermaleng.2020.115037
关键词:Laser photothermal method; Modeling; Non-conforming rough surfaces; Thermal conductivity; Thermal contact resistance
摘要:An experimental investigation of the thermal contact resistance (TCR) between non-conforming rough surfaces was conducted. Experiments demonstrated that the TCR of OFC-OFC (Oxygen-Free Copper) and SS304-SS304 (Stainless Steel 304) decreased as the thermal conductivity increased. Similarly, the TCR of AlN-AlN ceramics decreased when the thermal conductivity increased from 300 to 347 W·m−1·K−1 at temperatures ranging from 90 to 140 K. The variation between the TCR and the thermal conductivity first exhibited an increasing trend and then a decreasing trend. Experiments revealed that the effect of the material with the lower thermal conductivity was dominant, such as OFC-SS304 and OFC-AlN ceramics. The TCR of the dissimilar contact materials was influenced significantly by the material that demonstrated a lower thermal conductivity at 0.35 MPa. The TCR of OFC-OFC and the thermal conductivity exhibited an exponential relationship under low pressure conditions and a polynomial relationship when the external pressure ranged from 0.53 to 0.71 MPa. The relationship between the TCR of OFC-SS304 and the harmonic mean thermal conductivity exhibited an exponential relationship from 0.23 to 0.68 MPa. The results presented in this study provided not only a better understanding of the TCR but also a database for engineering applications. © 2020 Elsevier Ltd
收录类别:SCOPUS
资源类型:期刊论文
原文链接:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85079848124&doi=10.1016%2fj.applthermaleng.2020.115037&partnerID=40&md5=7bbe0e2601bb87440f82f91d19861d07
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