标题:Analysis of temperature and thermal stress distribution on kdp crystal wire saw slicing
作者:Jiao, Yang ;Ge, Pei Qi ;Gao, Yu Fei ;Bi, Wen Bo ;Ge, Pei Qi
通讯作者:Ge, Pei Qi
作者机构:[Jiao, Yang ;Ge, Pei Qi ;Gao, Yu Fei ;Bi, Wen Bo ] School of Mechanical Engineering, Shandong University, Jinan, China;[Ge, Pei Qi ] Key Laboratory of 更多
会议名称:10th CHINA-JAPAN International Conference on Ultra-Precision Machining Process, 10th CJUMP and 2014 International Conference on Surface Finishing Technology, ICSFT 2014
会议日期:17 October 2014 through 19 October 2014
来源:Advanced Materials Research
出版年:2014
卷:1027
页码:28-31
DOI:10.4028/www.scientific.net/AMR.1027.28
关键词:KDP crystal; Numerical simulation; Temperature field; Thermal stress; Wire saw slicing
摘要:Temperature variation of KDP crystal is an important reason for its cracking. A finite element model was constructed to analyze temperature and thermal stress distribution of KDP crystal during wire saw slicing. The results showed that the highest temperature of the crystal which was located on the sawing kerf remained stable during slicing. The temperature inside the crystal rose slowly at the start of the slicing, and then tended steady with the continued increase of sawing depth. Because of the good cooling condition during the sawing process, the overall rise in temperature was small, and the maximum thermal stress on the sawing kerf was less than the tensile strength of KDP crystal, so temperature variation during slicing had little effect on crystal cracking. © (2014) Trans Tech Publications, Switzerland.
收录类别:EI;SCOPUS
Scopus被引频次:3
资源类型:会议论文;期刊论文
原文链接:https://www.scopus.com/inward/record.uri?eid=2-s2.0-84921879570&doi=10.4028%2fwww.scientific.net%2fAMR.1027.28&partnerID=40&md5=17eff4ff5ce30d44674c3bdf9b56e9a5
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