标题：Thermal and stress analysis of rapid electric heating injection mold for a large LCD TV panel
作者：Xi-Ping Li;Ning-Ning Gong;Yan-Jin Guan;Guang-Ming Cheng
作者机构：College of Engineering, Zhejiang Normal University;College of Engineering, Zhejiang Normal University;Key Laboratory of Liquid S
来源：Applied thermal engineering: Design, processes, equipment, economics
关键词：Heat transfer process;Stress analysis;Electric heated injection mold
摘要：Rapid electric heating cycle injection molding technology has been used widely in injection engineering application. Using this technology, excellent products with no weld marks, flow marks and other surface defects can be produced. However, as the special mold structure and its worse working process, the rapid electric heated injection (EHI) mold is easy to fail than that of the conventional injection mold along with the injection process carried out repeatedly. In this paper, an EHI mold for a large liquid crystal display (LCD) TV panel was first presented. Then the heat transfer process of the mold during the working process was studied. Lastly, through finite element simulation, the reasons that cause the large thermal stress and deformation of the mold were analyzed. The practical failure of the mold proved that the analysis presented in the paper was right.