标题:Construction of Material Constitutive Relationship Based on Surface-Layer Model at Micro/Mesoscopic Scale
作者:Zhai, Jiqiang; Guan, Yanjin; Wang, Weiguo
通讯作者:Guan, Yanjin;Guan, YJ
作者机构:[Zhai, Jiqiang; Guan, Yanjin; Wang, Weiguo] Shandong Univ, Minist Educ, Key Lab Liquid Solid Struct Evolut & Proc Mat, Jinan 250061, Peoples R China.
会议名称:2nd Asian Pacific Symposium on Technology of Plasticity (APSTP) / 12th Asian Workshop on Micro/Nano Forming Technology (AWMFT)
会议日期:JUL 31-AUG 03, 2019
来源:MATERIALS TRANSACTIONS
出版年:2020
卷:61
期:2
页码:256-260
DOI:10.2320/matertrans.MT-ML2019016
关键词:micro-forming; constitutive relationship; surface layer model; Voronoi; method
摘要:Micro-forming process get extensive attention in the last decades as the rapid development of micro-manufacturing technology. But the traditional metal plastic forming theory becomes no longer applicable in micro-forming process because of the so-called size effect. Many factors such as size effect, grain boundary and grain orientation should be considered to reveal the plastic deformation behaviors of metal material in micro/mesoscopic scale. In this paper, on the basis of classical Hall-Petch relationship, combining the surface layer model and composite model, a constitutive model of material in micro/mesoscopic scale was established with further consideration of grain orientation. The micro-compression experiment of pure copper specimens with different diameters and grain sizes was conducted. Based on the experiment results, the established constitutive relationship was determined and verified, and high consistence and accuracy were found. Finally, the finite element model of micro specimen was built based on the established constitutive model and Voronoi method. Then the numerical simulation of upsetting process of the pure copper was executed, which showed that the simulation results could well reflect the flow stress and deformation of the material at micro/mesoscopic scale, and further proved the availability of the proposed model.
收录类别:CPCI-S;EI;SCOPUS;SCIE
资源类型:会议论文;期刊论文
原文链接:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85079214327&doi=10.2320%2fmatertrans.MT-ML2019016&partnerID=40&md5=db7d47f0b4c62b635c20b67d860db1a6
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