标题:Influences of Cutting Speed and Material Mechanical Properties on Chip Deformation and Fracture during High-Speed Cutting of Inconel 718
作者:Wang, Bing; Liu, Zhanqiang; Hou, Xin; Zhao, Jinfu
作者机构:[Wang, Bing] Shandong Univ, Sch Mat Sci & Engn, Jinan 250061, Shandong, Peoples R China.; [Wang, Bing; Liu, Zhanqiang; Hou, Xin; Zhao, Jinfu] Shando 更多
通讯作者:Wang, Bing
通讯作者地址:[Wang, B]Shandong Univ, Sch Mat Sci & Engn, Jinan 250061, Shandong, Peoples R China;[Wang, B; Liu, ZQ]Shandong Univ, Sch Mech Engn, MOE, Key Lab High 更多
来源:MATERIALS
出版年:2018
卷:11
期:4
DOI:10.3390/ma11040461
关键词:chip formation; constitutive and fracture parameters; sensitivity; analysis; high speed machining; Inconel 718
摘要:The paper aims to investigate the influences of material constitutive and fracture parameters in addition to cutting speed on chip formation during high-speed cutting of Inconel 718. Finite element analyses for chip formation are conducted with Johnson-Cook constitutive and fracture models. Meanwhile, experiments of high-speed orthogonal cutting are performed to verify the simulation results with cutting speeds ranging from 50 m/min to 7000 m/min. The research indicates that the chip morphology transforms from serrated to fragmented at the cutting speed of 7000 m/min due to embrittlement of the workpiece material under ultra-high cutting speeds. The parameter of shear localization sensitivity is put forward to describe the influences of material mechanical properties on serrated chip formation. The results demonstrate that the effects of initial yield stress and thermal softening coefficient on chip shear localization are much more remarkable than the other constitutive parameters. For the material fracture parameters, the effects of initial fracture strain and exponential factor of stress state on chip shear localization are more much prominent. This paper provides guidance for controlling chip formation through the adjustment of material mechanical properties and the selection of appropriate cutting parameters.
收录类别:EI;SCOPUS;SCIE
WOS核心被引频次:1
Scopus被引频次:1
资源类型:期刊论文
原文链接:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85044422025&doi=10.3390%2fma11040461&partnerID=40&md5=ab4b14e9820eb45614f586d50139c73c
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