标题:Microstructure analysis of Ti-Al intermetallic compound aluminized layer generated in low temperature
作者:Wang Xiu-Chun; Wei Jun; Zhang Lin-Lin; Yi Xi-Bin; Zhang Jing; Li, Mu-Sen
通讯作者:Wang, Xiu-Chun
作者机构:[Wang Xiu-Chun; Wei Jun; Zhang Lin-Lin; Yi Xi-Bin; Zhang Jing] Shandong Acad Sci, Inst New Mat, Jinan, Peoples R China.; [Zhang Lin-Lin] Shandong Ji 更多
会议名称:3rd International Conference on Civil, Architectural and Hydraulic Engineering (ICCAHE)
会议日期:JUL 30-31, 2014
来源:PROGRESS IN INDUSTRIAL AND CIVIL ENGINEERING III, PT 1
出版年:2014
卷:638-640
页码:1508-1511
DOI:10.4028/www.scientific.net/AMM.638-640.1508
关键词:Aluminized; Mechanical energy; titanium; intermetallic compound
摘要:By using mechanical energy aided aluminizing process, an aluminized layer of 20 similar to 180 mu m was obtained on titanium plate at a low temperature of 650 similar to 700 degrees C for 3 hours. The aluminized layer consists of an outer layer of single- phase aluminium, an inner layer of (Al,Si)(3)Ti intermetallic compound and aluminium bipolar layer, the silicon element is riched in the Al3Ti intermetallic compound.
收录类别:CPCI-S;EI;SCOPUS
资源类型:会议论文;期刊论文
原文链接:https://www.scopus.com/inward/record.uri?eid=2-s2.0-84949119285&doi=10.4028%2fwww.scientific.net%2fAMM.638-640.1508&partnerID=40&md5=2ee13be59fade9a6f5034135b2a31849
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