标题:Study of a pre-treatment process for electroless copper plating on ceramics
作者:Hongfang Ma*;Zhibao Liu;Ling Wuc;Yihan Wan;Xixia Wang
作者机构:[Ma, H] Department of Materials, Shandong Jianzhu University, Jinan 250101, China;[ Liu, Z] Shandong Chemical Industry Research Institute, Jinan 25001 更多
通讯作者:Ma, H
通讯作者地址:[Ma, HF]Shandong Jianzhu Univ, Dept Mat, Jinan 250101, Peoples R China.
来源:Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films
出版年:2011
卷:519
期:22
页码:7860-7863
DOI:10.1016/j.tsf.2011.05.005
关键词:Ceramics;Electroless plating;Nanopartides;Activation
摘要:In this paper, a pre-treatment process for electroless copper plating on the ceramics was explored. Due to the catalytic activity of gold nanoparticles, the traditional three-step coarsening-sensitization-activation pre-treatment process has been optimized to a two-step coarsening-activation process. In our study, the following results were observed: electroless copper coating on the ceramics was formed after activating the substrate by gold nanopartides; a more flat and compact nano-composite coating was also obtained by adding gold nanopartides to the plating solutions. The mechanisms of pre-treatment and composite plating with gold nanopartides were discussed.
收录类别:EI;SCOPUS;SCIE
WOS核心被引频次:18
Scopus被引频次:19
资源类型:期刊论文
原文链接:https://www.scopus.com/inward/record.uri?eid=2-s2.0-80052116670&doi=10.1016%2fj.tsf.2011.05.005&partnerID=40&md5=b9740839d06ba8ae845cbbf3e2a31531
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