标题：Study of a pre-treatment process for electroless copper plating on ceramics
作者：Hongfang Ma*;Zhibao Liu;Ling Wuc;Yihan Wan;Xixia Wang
作者机构：[Ma, H] Department of Materials, Shandong Jianzhu University, Jinan 250101, China;[ Liu, Z] Shandong Chemical Industry Research Institute, Jinan 25001 更多
通讯作者地址：[Ma, HF]Shandong Jianzhu Univ, Dept Mat, Jinan 250101, Peoples R China.
来源：Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films
摘要：In this paper, a pre-treatment process for electroless copper plating on the ceramics was explored. Due to the catalytic activity of gold nanoparticles, the traditional three-step coarsening-sensitization-activation pre-treatment process has been optimized to a two-step coarsening-activation process. In our study, the following results were observed: electroless copper coating on the ceramics was formed after activating the substrate by gold nanopartides; a more flat and compact nano-composite coating was also obtained by adding gold nanopartides to the plating solutions. The mechanisms of pre-treatment and composite plating with gold nanopartides were discussed.