标题：Deformation efficiency, homogeneity, and electrical resistivity of pure copper processed by constrained groove pressing
作者：Wang, Zong-Shen; Guan, Yan-Jin; Liang, Ping
作者机构：[Wang, Z.-S] Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials, Shandong University, Jinan 250061, China;[ Guan, Y.-J] 更多
通讯作者地址：[Guan, YJ]Shandong Univ, Minist Educ, Key Lab Liquid Solid Struct Evolut & Proc Mat, Jinan 250061, Peoples R China.
关键词：Constrained groove pressing;Processing efficiency;Strain homogeneity;Electrical resistivity
摘要：Constrained groove pressing (CGP) is a new severe plastic deformation method suitable for producing ultra-fine grained sheet metals. In this work, the processing efficiency for a muti-pass CGP of pure copper was investigated. With a relatively small groove width of 2 mm and tight constraint, a sharp variation of mechanical properties with pass number is observed. Subgrains with the size of similar to 0.5 mu m have distinct boundaries, which is the predominant feature in the microstructure after three passes. The evolution of deformation homogeneity characterized by micro-hardness distribution was examined in detail. Observations of optical micrographs and fracture surface morphology confirm the evolution rule. The relation between electrical resistivity and accumulative plastic strain was discussed. Crystalline defects, micro-cracks, and microstructure uniformity together determine the change of electrical resistivity of CGP copper.