标题:Ceramic-Metal Composite Filler for Thermally Conductive Underfill
作者:Tuan, Chia-Chi; Lian, Gang; Moon, Kyoung-Sik; Wong, Ching-Ping
作者机构:[Tuan, Chia-Chi; Lian, Gang; Moon, Kyoung-Sik; Wong, Ching-Ping] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA.; [Lian, Gang] Shan 更多
会议名称:66th IEEE Electronic Components and Technology Conference (ECTC)
会议日期:MAY 31-JUN 03, 2016
来源:2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
出版年:2016
卷:2016-August
页码:743-748
DOI:10.1109/ECTC.2016.284
关键词:underfill; thermal conductivity; aluminum; metal; ceramic
摘要:Effective thermal transport is one of the bottlenecks for the development of next-generation IC packages. In this report, we use a thermally conductive yet electrically insulating metal-ceramic hybrid filler of aluminum-aluminum oxide to study the thermal enhancement in epoxy-based underfill material. Metallic aluminum has thermal conductivity of 237 W/m.K, and here we report our study on the effect of inter-filler interactions on the thermal performance of epoxy composites. By having fillers to covalently bond with each other in a percolated filler network, relative thermal conductivity of nearly 900% is obtained. This work demonstrates the effect of inter-filler bonding for thermal enhancement considerations, which can be further applied to fillers with higher thermal conductivities for greater thermal enhancement.
收录类别:CPCI-S;EI;SCOPUS
WOS核心被引频次:1
Scopus被引频次:1
资源类型:会议论文;期刊论文
原文链接:https://www.scopus.com/inward/record.uri?eid=2-s2.0-84987819129&doi=10.1109%2fECTC.2016.284&partnerID=40&md5=70452e6bbbb92d3fe61791b548dcc3e8
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