标题:Numerical Simulation Investigation on the Temperature Field Distribution and Variations in Hot Stamping Process
作者:Zhang, Lei; Zhao, Guoqun; Li, Huiping
通讯作者:Zhang, L
作者机构:[Zhang, Lei; Zhao, Guoqun; Li, Huiping] Shandong Univ, Minist Educ, Key Lab Liquid Solid Struct Evolut & Proc Mat, Jinan 250061, Peoples R China.
会议名称:International Conference on Frontiers of Manufacturing and Design Science (ICFMD2010)
会议日期:DEC 11-12, 2010
来源:FRONTIERS OF MANUFACTURING AND DESIGN SCIENCE, PTS 1-4
出版年:2011
卷:44-47
页码:992-996
DOI:10.4028/www.scientific.net/AMM.44-47.992
关键词:Hot stamping; Die; Temperature; Heat transfer
摘要:With finite element software Abaqus, a coupled thermal mechanical simulation of hot stamping process of U-Channel part using high strength steel was performed. Through the analysis of the temperature field distribution on the die surface, the influence of contact state between die and blank on the temperature field distribution was discussed. With temperature history curve of a selected node on die corner, the heat flow on two contact boundaries (die surface and cooling water channel surface) was discussed and its effects rules on the die temperature were given.
收录类别:CPCI-S;EI;SCOPUS
资源类型:会议论文;期刊论文
原文链接:https://www.scopus.com/inward/record.uri?eid=2-s2.0-78651343399&doi=10.4028%2fwww.scientific.net%2fAMM.44-47.992&partnerID=40&md5=11b6c7deadb6f46e4f134e6dfbffa7eb
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