标题:A comparison among dry laser ablation and some different water-laser co-machining processes of single crystal silicon carbide
作者:Feng, Shao Chuan ;Huang, Chuan Zhen ;Wang, Jun ;Zhu, Hong Tao ;Yao, Peng ;Wang, Liang
通讯作者:Huang, Chuan Zhen
作者机构:[Feng, Shao Chuan ;Huang, Chuan Zhen ;Wang, Jun ;Zhu, Hong Tao ;Yao, Peng ;Wang, Liang ] Center for Advanced Jet Engineering Technologies (CaJET), Key 更多
会议名称:12th Asia-Pacific Conference on Materials Processing, APCMP2016
会议日期:16 June 2016 through 19 June 2016
来源:Materials Science Forum
出版年:2016
卷:861
页码:3-8
DOI:10.4028/www.scientific.net/MSF.861.3
关键词:Dry laser ablation; Hybrid laser-waterjet micro-machining; Low-pressure waterjet assisted laser machining; Single crystal silicon carbide; Under-water laser machining
摘要:Single crystal silicon carbide (SiC) is a new semiconductor material that has a great potential to be widely used. However, SiC is a kind of difficult-to-machine material due to its extreme hardness and brittleness. The present study investigated the machinability of single crystal SiC using dry laser and three different water-laser co-machining processes. The results indicate that using the hybrid laser-waterjet micro-machining to micro-groove single crystal SiC can derive the clean and straight edges and thermal-damage-free grooves. © 2016 Trans Tech Publications, Switzerland.
收录类别:EI;SCOPUS
Scopus被引频次:2
资源类型:会议论文;期刊论文
原文链接:https://www.scopus.com/inward/record.uri?eid=2-s2.0-84994113010&doi=10.4028%2fwww.scientific.net%2fMSF.861.3&partnerID=40&md5=4170624cd4116a4a829f86da3ced6484
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