标题：Wetting kinetics of SiC nanoparticle reinforced Sn-Pb eutectic solders
作者：Chen, Maoai ;Jiang, Yuanning ;Sekulic, D.P. ;Zhao, Hui
作者机构：[Chen, M] Key Lab for Liquid-Solid Structure Evolution and Materials Processing(Ministry of Education), Institute for Materials Joining, Shandong Univ 更多
关键词：wetting kinetics;composite solder;nanoparticle;spreadability
摘要：SiC nanoparticles reinforced eutectic Sn-Pb solder were prepared by mechanical mixing method. Reactive wetting of the resultant composite solders on Cu substrates was investigated using real time, in-situ visualization of the triple-line movement. It was found that spreading rates of all solder pastes in this work do not obey Tanner\'s law of non-reactive spreading. SiC nano-particles slow down both the pre-melting and post-melting spreading rates of composite solder pastes. As the content of SiC nano-particles increase, the melting point of composite solders decrease, and the spreading time of molten composite solder pastes increases.