标题:Wetting kinetics of SiC nanoparticle reinforced Sn-Pb eutectic solders
作者:Chen, Maoai ;Jiang, Yuanning ;Sekulic, D.P. ;Zhao, Hui
作者机构:[Chen, M] Key Lab for Liquid-Solid Structure Evolution and Materials Processing(Ministry of Education), Institute for Materials Joining, Shandong Univ 更多
通讯作者:Chen, M
来源:中国焊接
出版年:2010
卷:19
期:3
页码:16-20
关键词:wetting kinetics;composite solder;nanoparticle;spreadability
摘要:SiC nanoparticles reinforced eutectic Sn-Pb solder were prepared by mechanical mixing method. Reactive wetting of the resultant composite solders on Cu substrates was investigated using real time, in-situ visualization of the triple-line movement. It was found that spreading rates of all solder pastes in this work do not obey Tanner\'s law of non-reactive spreading. SiC nano-particles slow down both the pre-melting and post-melting spreading rates of composite solder pastes. As the content of SiC nano-particles increase, the melting point of composite solders decrease, and the spreading time of molten composite solder pastes increases.
收录类别:EI;SCOPUS
资源类型:期刊论文
原文链接:https://www.scopus.com/inward/record.uri?eid=2-s2.0-78449237136&partnerID=40&md5=71246219b8d4c4dded6c93b6f5c4ec8b
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