标题：Effect of Ni element on microstructure and properties of Sn-9Zn-3Bi lead-free solder
作者：Li, Guijie ;Wu, Xiufeng
作者机构：[Li, Guijie ;Wu, Xiufeng ] School of Materials Science and Engineering, Shandong University of Science and Technology, Qingdao; 266590, China
来源：Cailiao Daobao/Materials Review
页码：117-120 and 137
摘要：The Sn-9Zn-3Bi-xNi lead-free solder alloy was successfully prepared in the vacuum box resistance furnace and its microstructure, main properties (melting point, melting range, oxidation resistance, wettability, shear strength) and welding fractography were analyzed. The results showed that a few Ni addition could refine the microstructure of Sn-9Zn-3Bi alloy and slightly affect melting point. The solder melting range had little change when the Ni addition amount was 0.1% or 0.5%, but it varied obviously when the Ni addition amount was 1%. Both oxidation resistance and wettability of the alloy could be improved with the increasing Ni amount. Shear strength of the alloy had little change and the toughness could be enhanced when the Ni addition amount was 0.1% and 0.5%. The shear strength of the alloy increased slightly but the toughness decreased when the Ni addition amount was 1%.
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